HB - 2040/2060/2560/2580 Laser Cutting Machine for Large Enclosure Exchange Platform

HB - 2040/2060/2560/2580 Laser Cutting Machine for Large Enclosure Exchange Platform


Specifications
Details

  • Interactive platform greatly improves loading and unloading efficiency
  • The host has fast cutting speed, stable performance and high comprehensive cost-effectiveness
  • Large enclosure protection, partitioned dust removal and a cleaner and more aesthetically pleasing working environment

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